Carbon Tetrafluoride (CF₄)
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Technical Parameters
Specification 99.999% Oxygen+Argon ≤1ppm Nitrogen ≤4 ppm Moisture(H2O) ≤3 ppm HF ≤0.1 ppm CO ≤0.1 ppm CO2 ≤1 ppm SF6 ≤1 ppm Halocarbynes ≤1 ppm Total Impurities ≤10 ppm Carbon tetrafluoride is a halogenated hydrocarbon with the chemical formula CF4. It can be regarded as a halogenated hydrocarbon, halogenated methane, perfluorocarbon, or as an inorganic compound. Carbon tetrafluoride is a colorless and odorless gas, insoluble in water, soluble in benzene and chloroform. Stable under normal temperature and pressure, avoid strong oxidants, flammable or combustible materials. Non-combustible gas, the internal pressure of the container will increase when exposed to high heat, and there is a danger of cracking and explosion. It is chemically stable and non-flammable. Only liquid ammonia-sodium metal reagent can work at room temperature. Carbon tetrafluoride is a gas that causes the greenhouse effect. It is very stable, can stay in the atmosphere for a long time, and is a very powerful greenhouse gas. Carbon tetrafluoride is used in the plasma etching process of various integrated circuits. It is also used as a laser gas, and is used in low-temperature refrigerants, solvents, lubricants, insulating materials, and coolants for infrared detectors. It is the most used plasma etching gas in the microelectronics industry. It is a mixture of tetrafluoromethane high-purity gas and tetrafluoromethane high-purity gas and high-purity oxygen. It can be widely used in silicon, silicon dioxide, silicon nitride, and phosphosilicate glass. The etching of thin film materials such as tungsten and tungsten is also widely used in the surface cleaning of electronic devices, solar cell production, laser technology, low-temperature refrigeration, leak inspection, and detergent in printed circuit production. Used as a low-temperature refrigerant and plasma dry etching technology for integrated circuits. Precautions for storage: Store in a cool, ventilated non-combustible gas warehouse. Keep away from fire and heat sources. The storage temperature should not exceed 30°C. It should be stored separately from easily (combustible) combustibles and oxidants, and avoid mixed storage. The storage area should be equipped with leakage emergency treatment equipment.
Key words:
Packaging Gas | Bulk Liquids
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